Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications-Reference-Cited by-同舟云学术

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Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Grafner S.J.¹,Huang J.H.¹,Shih P.S.¹,Renganathan V.¹,Kung P.Y.¹,Chen Y.A.¹,Huang C.H.¹,Chen C.H.¹,Kao C.R.¹

Affiliation:

1. National Taiwan University,Department of Materials Science and Engineering

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013221.pdf?arnumber=10013221

Reference21 articles.

1. Low-Temperature Bonding of Copper Pillars for All-Copper Chip-to-Substrate Interconnections

2. A Mathematical Model for Electroless Copper Deposition on Planar Substrates

3. Analysis of an Electroless Plating Problem;girault;HAL,2019

4. Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow

5. Flow in a microchannel filled with arrays of numerous pillars

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications;Materials;2024-04-03

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