Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications
Author:
Affiliation:
1. National Taiwan University,Department of Materials Science and Engineering
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013221.pdf?arnumber=10013221
Reference21 articles.
1. Low-Temperature Bonding of Copper Pillars for All-Copper Chip-to-Substrate Interconnections
2. A Mathematical Model for Electroless Copper Deposition on Planar Substrates
3. Analysis of an Electroless Plating Problem;girault;HAL,2019
4. Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow
5. Flow in a microchannel filled with arrays of numerous pillars
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