Author:
Feng Shuai,Yan Yunfei,Li Haojie,Xu Fulei,Zhang Li
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference37 articles.
1. DARPA's intra/interchip enhanced cooling (ICECool) program;Bar-Cohen,2013
2. Detailed investigation of staggered jet impingement array cooling performance with cubic micro pin fin roughened target plate;Chen;App. Therm. Eng.,2020
3. New mechanism insights into methane steam reforming on Pt/Ni from DFT and experimental kinetic study;Niu;Fuel,2020
4. Advanced thermal management technologies for defense electronics, in: Proceedings of SPIE 8405;Bloschock;Defense Transf. Net-Centric Syst.,2012
5. A novel thermal management scheme for 3D-IC chips with multi-cores and high power density;Ding;App. Therm. Eng.,2020
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献