Heat transfer characteristics investigations on liquid-cooled integrated micro pin-fin chip with gradient distribution arrays and double heating input for intra-chip micro-fluidic cooling

Author:

Feng Shuai,Yan Yunfei,Li Haojie,Xu Fulei,Zhang Li

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference37 articles.

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4. Advanced thermal management technologies for defense electronics, in: Proceedings of SPIE 8405;Bloschock;Defense Transf. Net-Centric Syst.,2012

5. A novel thermal management scheme for 3D-IC chips with multi-cores and high power density;Ding;App. Therm. Eng.,2020

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