Enhancing thermal transport across diamond/graphene heterostructure interface-Reference-Cited by-同舟云学术

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Enhancing thermal transport across diamond/graphene heterostructure interface

Published:2023-08 Issue: Volume:209 Page:124123
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Liu Yiling,Qiu Lin^ORCID,Liu Jinlong,Feng Yanhui^ORCID

Funder

Beijing Nova Program

University of Science and Technology Beijing

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference32 articles.

1. Weaker bonding can give larger thermal conductance at highly mismatched interfaces;Xu;Sci. Adv.,2021

2. A review of recent advances in thermophysical properties at the nanoscale: from solid state to colloids;Qiu;Phys. Rep.,2020

3. Enhancing the interfacial interaction of carbon nanotubes fibers by Au nanoparticles with improved performance of the electrical and thermal conductivity;Qiu;Carbon N Y,2019

4. Interfacial heat transport in nano-carbon assemblies;Qiu;Carbon N Y,2021

5. Elaborate manipulation on CNT intertube heat transport by using a polymer knob;Qiu;Int. J. Heat Mass Transf.,2022

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanism of interfacial thermal resistance variation in diamond/Cu/CNT tri-layer during thermal cycles;International Journal of Thermal Sciences;2025-01

2. Molecular interpretation for the synergistic catalysis of platinum/hyperbranched polyethyleneimine composites on the pyrolysis of endothermic hydrocarbon fuels;International Journal of Heat and Mass Transfer;2024-11

3. Quantitative analysis of interface heat transport at the Si3N4/SiO2 van-der Waals point contact;International Journal of Heat and Mass Transfer;2024-11

4. Low temperature preparation of the monolayer-graphene/diamond heterostructure with superior mechanical properties;Carbon;2024-10

5. Heat Dissipation Enhancement of High-Power Deep-Ultraviolet LEDs Through Plated Copper on Thick Film Diamond Substrates;IEEE Electron Device Letters;2024-09

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