Conventional and topologically optimized polymer manifolds for direct cooling of power electronics-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Conventional and topologically optimized polymer manifolds for direct cooling of power electronics

Published:2023-02 Issue: Volume:201 Page:123611
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Lad Aniket Ajay^ORCID,Tayade Ashrit^ORCID,Hoque Muhammad Jahidul,Zhao Yue,Balda Juan Carlos,King William P.^ORCID,Miljkovic Nenad

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference95 articles.

1. Driving Toward Accessibility: A Review of Technological Improvements for Electric Machines, Power Electronics, and Batteries for Electric and Hybrid Vehicles;Sarlioglu;IEEE Ind. Appl. Mag.,2017

2. D.J. Perreault, J. Hu, J.M. Rivasy, Y. Han, O. Leitermann, R.C.N. Pilawa-Podgurski, A. Sagneri, C.R. Sullivan, Opportunities and challenges in Very High Frequency power conversion, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC. (2009) 1–14. doi:10.1109/APEC.2009.4802625.

3. Ultrawide-Bandgap Semiconductors: Research Opportunities and Challenges;Tsao;Adv. Electron. Mater.,2018

4. Design, Operation, and Loss Characterization of a 1-kW GaN-Based Three-Level Converter at Cryogenic Temperatures;Barth;IEEE Trans. Power Electron.,2020

5. A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages;Sathe;J. Heat Transfer,1998

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fin Design Topology Optimization for Direct Liquid Cooling of Multichip Power Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

2. Topology Optimized Fin Designs for Base Plate Direct-Cooled Multi-Chip Power Modules;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3