Cooling chip on PCB by embedded active microchannel heat sink-Reference-Cited by-同舟云学术

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Cooling chip on PCB by embedded active microchannel heat sink

Published:2022-11 Issue: Volume:196 Page:123251
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Peng Yun-Hao,Wang Dai-Hua,Li Xin-Yu,Zhang Ying

Funder

Graduate School, Chongqing University

National Natural Science Foundation of China

State Administration for Science, Technology and Industry for National Defense

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference37 articles.

1. A comparative study of experimental flow boiling heat transfer and pressure drop characteristics in porous-wall microchannel heat sink;Jia;Int. J. Heat Mass Transf.,2018

2. High-performance heat sinking for VLSI;Tuckerman;Electron Dev. Lett.,1981

3. A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks;Deng;Int. J. Heat Mass Transf.,2021

4. Heat transfer and fluid flow characteristics in microchannels heat exchanger using nanofluids: a review;Mohammed;Renew. Sustain. Energy Rev.,2011

5. Electronics cooling with nanofluids: a critical review;Bahiraei;Energy Convers. Manage.,2018

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