Numerical investigation of the influence of heat-generating components on the heat dissipation in a tower server
Author:
Funder
State Administration for Market Regulation
Publisher
Elsevier BV
Reference34 articles.
1. Cooling chip on PCB by embedded active microchannel heat sink;Peng;Int. J. Heat Mass Transf.,2022
2. Optimizing cooling electronic chips at high altitude with consideration of solar radiation;Li;Int. J. Therm. Sci.,2023
3. Performance analysis and structural optimization of a finned liquid-cooling radiator for chip heat dissipation;He;Appl. Energy,2022
4. Numerical and experimental study on cooling high power chips of data centers using double-side cooling module based on mini-channel heat sink;Deng;Appl. Therm. Eng.,2023
5. Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools;Bailey;10th Electron. Packag. Technol. Conf.,2008
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