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Experimental study on thermal performances of ultra-thin flattened heat pipes

  • Published:2019-05 Issue: Volume:134 Page:884-894
  • ISSN:0017-9310
  • Container-title:International Journal of Heat and Mass Transfer
  • language:en
  • Short-container-title:International Journal of Heat and Mass Transfer

Author:

Tang Yongle,Hong Sihui,Wang Shuangfeng,Deng Dewen

Funder

National Key Research & Development Program of China

National Natural Science Foundations of China

Central university scientific research project

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference25 articles.

1. Integrated thermal management techniques for high power electronic devices;McGlen;Appl. Therm. Eng.,2004

2. Recent developments of lightweight, high performance heat pipes;Yang;Appl. Therm. Eng.,2012

3. Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment;Putra;Exp. Therm. Fluid Sci.,2011

4. Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices;Ahamed;Heat Mass Transf.,2017

5. Development status and perspective trend of ultra-thin micro heat pipe;Tang;J. Mech. Eng.,2017
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