Experimental investigation on the heat transfer performance of flat heat pipe embedded with internally cooled condenser
Author:
Funder
Science and Engineering Research Board
Department of Science and Technology, Ministry of Science and Technology, India
National Science and Technology Development Agency
Thailand Science Research and Innovation
Publisher
Elsevier BV
Reference40 articles.
1. Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview;Rakshith;Renew. Sustain. Energy Rev.,2022
2. Composite filament with super high effective thermal conductivity;Kang;Mater. Today Phys.,2023
3. Bifurcated divergent microchannel heat sinks for enhanced micro-electronic cooling;Fathi;Int. Commun. Heat Mass Transf.,2023
4. A review on advanced carbon-based thermal interface materials for electronic devices;Khan;Carbon N. Y.,2020
5. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review;He;Energy,2021
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