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Temperature distribution and thermal resistance analysis of high-power laser diode arrays

  • Published:2019-05 Issue: Volume:134 Page:41-50
  • ISSN:0017-9310
  • Container-title:International Journal of Heat and Mass Transfer
  • language:en
  • Short-container-title:International Journal of Heat and Mass Transfer

Author:

Deng Zeng,Shen Jun,Gong Wenchi,Dai Wei,Gong Maoqiong

Funder

National Key Research and Development Plan

Scientific and Equipment Research Project, CAS

Critically Arranged Project, CAS

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference37 articles.

1. Packaging Process of High Power Semiconductor Lasers;Liu,2015

2. An analytical solution for two-dimensional modeling of repetitive long pulse laser heating material;Chen;Int. J. Heat Mass Transf.,2017

3. 808nm high-power high-efficiency GaAsP/GaInP laser bars (EI Conference);Wang;Proc. SPIE - Int. Soc. Opt. Eng.,2008

4. Lifetime tests and junction-temperature measurement of InGaN light-emitting diodes using patterned sapphire substrates;Tsai;J. Lightwave Technol.,2007

5. Temperature dependence of threshold current for quantum well AlxGa1−xAs-GaAs heterostructure laser diodes;Chin;Appl. Phys. Lett.,1980

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