Author:
Lee Hyoungsoon,Kharangate Chirag R.,Mascarenhas Nikhin,Park Ilchung,Mudawar Issam
Funder
National Aeronautics and Space Administration
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference86 articles.
1. Pool boiling heat transfer from enhanced surfaces to dielectric fluids;Marto;J. Heat Transfer – Trans. ASME,1982
2. W. Nakayama, T. Nakajima, S. Hirasawa, Heat sink studs having enhanced boiling surfaces for cooling of microelectronic components, ASME Paper 84-WA/HT-89, 1984.
3. Microelectronic cooling by enhanced pool boiling of a dielectric fluorocarbon liquid;Anderson;J. Heat Transfer – Trans. ASME,1989
4. High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks;Bowers;Int. J. Heat Mass Transfer,1994
5. Small circular- and rectangular-channel boiling with two refrigerants;Tran;Int. J. Multiphase Flow,1996
Cited by
153 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献