Finite element analysis of lead-free surface mount devices-Reference-Cited by-同舟云学术

Finite element analysis of lead-free surface mount devices

Published:2008-07 Issue:1 Volume:43 Page:212-220
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Hegde Pradeep,Ochana Andrew R.,Whalley David. C.,Silberschmidt Vadim. V.

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference10 articles.

1. Thermal Stress and Strain in Microelectronics Packaging;Lau,1993

2. The impact of thermal cycling regime on the shear strength of lead‐free solder joints

3. B. Vandevelde, M. Gonzalez, P. Limaye, P. Ratchev, J. Vanfleteren, E. Beyne, Lead Free Solder Joint Reliability Estimation by Finite Element Modeliing Advantages, Challenges and Limitations, IMEC, Leuven, Belgium. IPC 7th international conference on Lead-free electronic components and assemblies, Frankfurt, Germany, October 21–22, 2004.

4. Thermal cycling analysis of flip-chip solder joint reliability

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