Effect of tool edge radius on material removal mechanism of single-crystal silicon: Numerical and experimental study-Reference-Cited by-同舟云学术

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Effect of tool edge radius on material removal mechanism of single-crystal silicon: Numerical and experimental study

Published:2019-06 Issue: Volume:163 Page:127-133
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Liu Bing,Xu Zongwei,Chen Cheng,Pang Kuo,Wang Yong,Ruan Qinghai

Funder

National Natural Science Foundation of China

Natural Science Foundation of Tianjin

State Key Laboratory of Precision Measuring Technology and Instruments

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference23 articles.

1. Anisotropy of single-crystal silicon in nanometric cutting;Wang;Nanoscale Res. Lett.,2017

2. Study on ductile mode machining of single-crystal silicon by mechanical machining;Choi;Int. J. Mach. Tool Manu.,2017

3. Influence of fixed abrasive configuration on the polishing process of silicon wafers;Fang;Int. J. Adv. Manuf. Technol.,2017

4. Size effect in material removal by cutting at nano scale;Fang;Int. J. Adv. Manuf. Technol.,2015

5. Large-area gold/parylene plasmonic nanostructures fabricated by direct nanocutting;Auzelyte;Adv. Opt. Mater.,2013

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Controllable diamond cutting of structured surfaces with subnanometric height features on silicon;Precision Engineering;2024-10

2. Influence of tool-edge radius on the nano-cutting process of non-continuous surfaces in single-crystal silicon;Materials Today Communications;2024-03

3. Material Removal Mechanism and Evolution of Subsurface Defects during Nanocutting of Monocrystalline Cu;Nanomaterials and Nanotechnology;2023-12-13

4. Numerical Investigation on the Effects of Grain Size and Grinding Depth on Nano-Grinding of Cadmium Telluride Using Molecular Dynamics Simulation;Nanomaterials;2023-09-29

5. Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method;Tribology International;2023-09

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