Influence of fixed abrasive configuration on the polishing process of silicon wafers-Reference-Cited by-同舟云学术

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Influence of fixed abrasive configuration on the polishing process of silicon wafers

Published:2016-04-26 Issue:1-4 Volume:88 Page:575-584
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Fang Congfu,Zhao Zaixing,Lu Longyuan,Lin Yanfen

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China (CN)

the Project of Natural Science Foundation of Fujian Province

Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s00170-016-8808-9.pdf

Reference35 articles.

1. Yuan JL, Wang ZW, Wen DH, Lu BH, Dai Y (2000) Review of the current situation of ultra-precision machining. Chin J Mech Eng 43(1):35–48

2. Su JX, Guo DM, Kang RK, Jin ZJ, Li XJ, Tian YB (2004) Modeling and analyzing on nonuniformity of material removal in chemical mechanical polishing of silicon wafer. Mater Sci Forum 471–472:26–31. doi: 10.4028/www.scientific.net/MSF.471-472.26

3. Sousa FJP, Aurich JC, Weingaertner WL, Alarcon OE (2007) Kinematics of a single abrasive particle during the industrial polishing process of porcelain stoneware tiles. J Eur Ceram Soc 10:3183–3190. doi: 10.1016/j.jeurceramsoc.2006.12.007

4. Shan L, Levert J, Meade L, Tichy J, Danyluk S (1999) Interfacial fluid mechanics and pressure prediction in chemical mechanical polishing. J Tribol 122(3):539–543. doi: 10.1115/1.555398

5. Wang CL, Jin ZJ, Kang RK (2008) Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation. Int J Mater Prod Technol 31:54–62. doi: 10.1504/IJMPT.2008.015895

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