Kirkendall voids in the intermetallic layers of solder joints in MEMS-Reference-Cited by-同舟云学术

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Kirkendall voids in the intermetallic layers of solder joints in MEMS

Published:2009-05 Issue:3 Volume:45 Page:827-831
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Weinberg Kerstin,Böhme Thomas,Müller Wolfgang H.

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference14 articles.

1. Statistical theory of nucleation, condensation and coagulation

2. Analysis of stress‐induced void growth mechanisms in passivated interconnect lines

3. Spinodal decomposition: A reprise

4. Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

5. Ductile fracture by vacancy condensation in f.c.c. single crystals

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