Effect of Surface Microstructure on Joints Using Nanoporous Cu Sheet for Power Devices
Author:
Affiliation:
1. Joing and Welding Research Institute, Osaka University,Osaka,Japan
2. Graduate school of Engineering, Osaka University,Osaka,Japan
3. Waseda University,Reseach Organization for Nano & Life Inovation,Tokyo,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418278.pdf?arnumber=10418278
Reference8 articles.
1. Metal?metal bonding process using Ag metallo-organic nanoparticles
2. Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips
3. A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
4. Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles
5. Evolution of nanoporosity in dealloying
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