Design and Technology Solutions for 3D Integrated High Performance Systems
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9492225/9492226/09492421.pdf?arnumber=9492421
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Self-Heating Effect of Device-Circuit with Back-side Power Delivery Network beyond 3nm Node;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
4. Detection of bonding voids in multi-tier stacks with scanning acoustic microscope;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
5. Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies;IEEE Transactions on Device and Materials Reliability;2023-12
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