Author:
Fujino Masahisa,Takahashi Kenji,Kikuchi Katsuya
Cited by
4 articles.
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1. Wafer-level Sn-Ag-Cu/SiO2 Transient Liquid Phase Hybrid Bonding (TLP-HB) Technology;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Wafer Level High Density Hybrid Bonding for High Performance Computing;2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2020-07-20
3. Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5μm pitch;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
4. 300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum;Japanese Journal of Applied Physics;2019-11-26