Wafer Level High Density Hybrid Bonding for High Performance Computing-Reference-Cited by-同舟云学术

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Wafer Level High Density Hybrid Bonding for High Performance Computing

Published:2020-07-20 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Author:

Ji Hong-Miao,Ji Lin,Che Fa-Xing,Li Hong-Yu.,Chui King-Jien,Kawano Masaya

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9260488/9260588/09260626.pdf?arnumber=9260626

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding;Journal of Electroanalytical Chemistry;2024-09

2. Virtual metrology in semiconductor manufacturing: Current status and future prospects;Expert Systems with Applications;2024-09

3. Development of Wafer Bonding System for High Precision Bonding Alignment;International Journal of Precision Engineering and Manufacturing;2024-08-06

4. Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly <111>-Oriented Nanotwinned Cu;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration;Microelectronics International;2022-12-27

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