M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9112295/9116186/09116293.pdf?arnumber=9116293
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. TEFLON: Thermally Efficient Dataflow-aware 3D NoC for Accelerating CNN Inferencing on Manycore PIM Architectures;ACM Transactions on Embedded Computing Systems;2024-08-14
2. INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
3. Built-In Self-Test of High-Density and Realistic ILV Layouts in Monolithic 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-03
4. Aggressive GPU cache bypassing with monolithic 3D-based NoC;The Journal of Supercomputing;2022-10-21
5. Advanced 3d Design and Technologies for 3-Layer Smart Imager;2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA);2022-04-18
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