Wafer-Level Test Path Pattern Recognition and Test Characteristics for Test-Induced Defect Diagnosis-Reference-Cited by-同舟云学术

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Wafer-Level Test Path Pattern Recognition and Test Characteristics for Test-Induced Defect Diagnosis

Published:2020-03 Issue: Volume: Page:
ISSN:
Container-title:2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)
language:
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Author:

Cheng Ken Chau-Cheung,Shu-Min Li Katherine,Huang Andrew Yi-Ann,Li Ji-Wei,Chen Leon Li-Yang,Cheng-Yen Tsai Nova,Wang Sying-Jyan,Lee Chen-Shiun,Chou Leon,Liao Peter Yi-Yu,Liang Hsing-Chung,Chen Jwu-E

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9112295/9116186/09116546.pdf?arnumber=9116546

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In-line imaging and recognition of flip chip fabrication defects by real-time photoacoustic remote sensing system;Photoacoustics;2024-08

2. Using BERT Pre-Trained Image Transformers to Identify Potential Parametric Wafer Map Defects;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

3. A survey on machine and deep learning in semiconductor industry: methods, opportunities, and challenges;Cluster Computing;2023-09-04

4. Graph neural networks for parameter estimation in micro-electro-mechanical system testing;Array;2022-07

5. Challenges and recent prospectives of 3D heterogeneous integration;e-Prime - Advances in Electrical Engineering, Electronics and Energy;2022

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