Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders
Author:
Affiliation:
1. National Cheng Kung University,Department of Materials Science and Engineering,Tainan,Taiwan,70101
2. Osaka University,Joining and Welding Research Institute,Osaka,Japan,567-0047
Funder
Ministry of Science and Technology
Ministry of Education
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795572.pdf?arnumber=9795572
Reference31 articles.
1. On the Design of Sn-Bi-Ag-In and Sn-Bi-Ag-Zn Low-Temperature Pb-Free Solders Using High-Throughput CALPHAD Modeling and Key Experiments
2. Effects of Zn addition on mechanical properties of eutectic Sn–58Bi solder during liquid-state aging;ping;Transactions of Nonferrous Metals Society of China,2015
3. Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
4. Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy
5. The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
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