Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints
Author:
Affiliation:
1. The Hong Kong University of Science and Technology,Electronic Packaging Laboratory,Hong Kong,SAR,China
2. The Hong Kong University of Science and Technology,Department of Mechanical and Aerospace Engineering,Hong Kong,SAR,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795503.pdf?arnumber=9795503
Reference6 articles.
1. Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages
2. Reliability of ICA attachment of SMDs on inkjet-printed substrates
3. Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)
4. Assembly of Components on Inkjet-Printed Silver Structures by Soldering
5. Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality
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1. Photonic curing and soldering to printed silver for enhanced attachment and joint quality;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Reliable and Automated Connection of Printed Electronics to the Aviation Electrical System;2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific);2024-01-29
3. Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates;Journal of Manufacturing and Materials Processing;2022-10-09
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