High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications-Reference-Cited by-同舟云学术

High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

Published:2021-01-12 Issue: Volume: Page:
ISSN:
Container-title:2020 50th European Microwave Conference (EuMC)
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Author:

Murugesan Kavin Senthil¹,Chernobryvko Mykola²,Zinal Sherko²,Rossi Marco²,Ndip Ivan²,Boettcher Mathias²,Lang Klaus Dieter¹,Wieland Marcel³,Goetze Christian³,Halim Saquib Bin³,Trewhella Jean³

Affiliation:

1. Technische Universität,Berlin,Germany

2. Fraunhofer Institute for Reliability and Microintegration,IZM,Germany

3. GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9337937/9337948/09337984.pdf?arnumber=9337984

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