High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany
2. Chalmers University of Technology,Gothenburg,Sweden
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418411.pdf?arnumber=10418411
Reference18 articles.
1. A review of spaced based RF propagation experiments and examination of a new interest in W/V band (40–110 GHz) studies
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3. A low phase noise W-band MMIC GaN HEMT oscillator
4. A compact W-band LFMCW radar module with high accuracy and integrated signal processing
5. A Low-Phase-Noise 77-GHz FMCW Radar Transmitter With a 12.8-GHz PLL and a $\times$ 6 Frequency Multiplier
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