Simulation study of the magnetic material patterning on the high frequency planer inductor in 5G device application
Author:
Affiliation:
1. FUJIFILIM Corporation,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457685.pdf?arnumber=10457685
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1. An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging Applications
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4. Concepts for a Monostatic Radar Transceiver Front-end in eWLB Package with Off-Chip QuasiCirculator for 60 GHz
5. Green Poly-Si TFTs: RF Breakthroughs (ft/fmax = 63.6/30 GHz) by an Ingenious Process design for loT Modules on Everything;Ye;IEEE IEDM 2021
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