Enhanced Cu-to-Cu Bonding by Using Sn Passivation Layer
Author:
Affiliation:
1. National Taiwan University,Department of Materials Science and Engineering,Taipei,Taiwan, R.O.C.
2. Advanced Semiconductor Engineering (ASE) Group,Product Characterization, Corporate R&D,Kaohsiung City,Taiwan
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129779.pdf?arnumber=10129779
Reference8 articles.
1. Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
2. Investigation of diffusion behavior in Cu–Sn solid state diffusion couples
3. A Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation Layer
4. Bonding parameters of blanket copper wafer bonding
5. Cu/Sn SLID wafer-level bonding optimization
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