Bonding parameters of blanket copper wafer bonding-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Bonding parameters of blanket copper wafer bonding

Published:2006-02 Issue:2 Volume:35 Page:230-234
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen K. N.,Fan A.,Tan C. S.,Reif R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02692440.pdf

Reference21 articles.

1. M.T. Bohr,IEDM Tech. Dig., p. 241 (1995).

2. A. Rahman and R. Reif,IEEE Trans. VLSI 8, 671 (2000).

3. The 2002 International Technology Roadmap for Semiconductors, 2002.

4. A.L. Rosenberg,J. ACM 30, 397 (1983).

5. W.J. Dally,Proc. Int. Interconnect Technology Conf. (Piscataway, NJ: IEEE, 1998), pp. 15–17.

Cited by 59 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition;ACS Applied Materials & Interfaces;2024-08-27

2. Comparative Analysis of Crosslinking Methods and Their Impact on the Physicochemical Properties of SA/PVA Hydrogels;Materials;2024-04-15

3. Microstructural effects of copper deposits on direct bonding for 3D IC integration;Journal of Materials Research and Technology;2024-01

4. Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification;Applied Surface Science;2023-11

5. Patterned Cu Nanoparticle Film for All-Cu Interconnection Without Chemical Mechanical Polishing Pretreatment;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3