Analytical study on stress and strain of power chip laminated structure
Author:
Affiliation:
1. Huazhong University of Science and Technology,State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering,Wuhan,China,430074
2. Chengdu Perfect Technology Co., Ltd,Chengdu,China,610404
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129786.pdf?arnumber=10129786
Reference7 articles.
1. Research on Equivalent Approach for Mechanical Property of Thick Composite Laminates;jiang;Machine Building & Automation,2017
2. Design guideline on board-level thermomechanical reliability of 2.5D package
3. Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective
4. Reliability study of PCB-embedded power dies using solderless pressed metal foam
5. Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading;lim;Eng Fail Anal,2020
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