Reliability study of PCB-embedded power dies using solderless pressed metal foam

Author:

Bensebaa S.,Berkani M.,Lefebvre S.,Petit M.,Schmitt N.,Zhang S.

Funder

École Normale Supérieure

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Parasitics in power electronics packaging;Hamidi,2004

2. PCB embedded semiconductors for low-voltage power electronic applications;Kearney;IEEE Trans. Compon. Packag. Manuf. Technol.,2017

3. Silicon carbide power chip on chip module based on embedded die technology with paralleled dies;Regnat,2015

4. Huazhong University of Science and Technology C. Chen, A review of SiC power module packaging: layout, material system and integration, CPSS Transactions on Power Electronics and Applications, vol. 2, n° 3, p. 170–186, sept. 2017, doi: 10.24295/CPSSTPEA.2017.00017.

5. PCB-embedding of power dies using pressed metal foam;Pascal,2018

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1. Analytical study on stress and strain of power chip laminated structure;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

2. Thermal Performance Analysis and Prediction of Printed Circuit Boards;Journal of Circuits, Systems and Computers;2023-02-27

3. On-line temperature measurement during power cycle of PCB-embedded diode;Microelectronics Reliability;2021-11

4. Investigation of Bondply Leakage Disposition at Inner PCB Layers During Process of Thermal-Pressure Bonding;2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus);2021-01-26

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