Ultra-Low Thermal Conductivity in W/Al 2 O 3 Nanolaminates-Reference-Cited by-同舟云学术

Ultra-Low Thermal Conductivity in W/Al 2 O 3 Nanolaminates

Published:2004-02-13 Issue:5660 Volume:303 Page:989-990
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Costescu R. M.¹²,Cahill D. G.¹²,Fabreguette F. H.¹²,Sechrist Z. A.¹²,George S. M.¹²

Affiliation:

1. Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana, IL 61801, USA.

2. Department of Chemistry and Biochemistry, University of Colorado, Boulder, CO 80309, USA.

Abstract

Atomic layer deposition and magnetron sputter deposition were used to synthesize thin-film multilayers of W/Al 2 O 3 . With individual layers only a few nanometers thick, the high interface density produced a strong impediment to heat transfer, giving rise to a thermal conductivity of ∼0.6 watts per meter per kelvin. This result suggests that high densities of interfaces between dissimilar materials may provide a route for the production of thermal barriers with ultra-low thermal conductivity.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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