1. Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia.
2. IBM Research–Zurich, Rüschlikon, Switzerland.
3. Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109, USA.
4. Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
5. Department of Electrical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan.
6. Microelectronics Research Center, University of Texas, Austin, TX, USA.
7. Dipartimento di Ingegneria “Enzo Ferrari,” Università di Modena e Reggio Emilia, 41125 Modena, Italy.
8. Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
9. Departamento de Electrónica y Tecnología de Computadores, Facultad de Ciencias, Universidad de Granada, 18071 Granada, Spain.