Study on heat transfer performance of cold plate with grid channel

Abstract

Abstract The utilization of cold plate radiators as a prevalent method for indirect liquid cooling has been extensively investigated and implemented in server cooling systems. However, there is a lack of comprehensive study on the application of this technology at the chip size, indicating a need for more development and exploration in this area. A proposal was made for a grid-channel chip cold plate heat sink to facilitate the dissipation of heat from a chip. tests were conducted to investigate the impact of the flow rate of the cold plate and the layout of the inlet and outlet on various thermal parameters, including the average temperature, maximum temperature, thermal resistance, and uniformity coefficient of the cold plate. The tests were specifically conducted under a chip power of 150W, and the accuracy of the simulation was confirmed through the use of FLUENT. The findings indicate that the cold plate effectively regulates the temperature of the chip, ensuring it remains below 85℃ throughout all experimental groups. In contrast to the single in single out (SISO) configuration, the single-in multiple-out (SIMO) layout exhibits a higher degree of temperature uniformity within the cold plate. Nevertheless, it is important to note that augmenting the quantity of exits does not guarantee an improvement in heat transfer efficiency. This outcome is contingent upon the presence of a longitudinal flow channel shared by the outlet and intake, as well as the dispersion characteristics of the outlet. Enhancing the dispersion of the exit can significantly enhance the thermal transfer efficiency of the cold plate.