Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press Book Series on Electronic Packaging-Reference-Cited by-同舟云学术

Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press Book Series on Electronic Packaging

Published:2003-05-01 Issue:3 Volume:56 Page:B46-B48
ISSN:0003-6900
Container-title:Applied Mechanics Reviews
language:en
Short-container-title:

Author:

Yeh, Lian-Tua¹,Chu, RC²,Janna, WS³

Affiliation:

1. Lockheed Martin Vought Syst, Propulsion and Thermodynamics, PO Box 650003, MS SP-97, Dallas, TX 75265-0003

2. Dept AYJB, M/S P520, IBM Corp, 522 South Rd, Poughkeepsie, NY 12601

3. Herff Col of Eng, Univ of Memphis, 201E Eng Admin, Memphis, TN 38152

Publisher

ASME International

Subject

Mechanical Engineering

Link

http://asmedigitalcollection.asme.org/appliedmechanicsreviews/article-pdf/56/3/B46/5439890/b34_1.pdf

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