Novel hydrophilic SiO2wafer bonding using combined surface-activated bonding technique
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/54/i=3/a=030218/pdf
Reference30 articles.
1. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics
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4. A Model of Low‐Temperature Wafer Bonding And Its Applications
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2. Atomistic simulation analysis of plasma surface activation in wafer-to-wafer oxide fusion bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices;Journal of Materials Science & Technology;2020-06
4. Direct Heterogeneous Bonding of SiC to Si, SiO2, and Glass for High-Performance Power Electronics and Bio-MEMS;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05
5. Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding;ECS Transactions;2016-09-23
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