Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding
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The Electrochemical Society
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Efficient fabrication of high-quality hybrid periodic nanostructures on 4H-SiC using a single-step vector femtosecond laser processing;Optics & Laser Technology;2024-12
2. A Review of Mechanism and Technology of Hybrid Bonding;Journal of Electronic Packaging;2024-07-25
3. Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification;Applied Surface Science;2023-11
4. Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding;Journal of Materials Research and Technology;2023-11
5. High-Responsivity and Broadband MoS2 Photodetector Using Interfacial Engineering;ACS Applied Materials & Interfaces;2023-09-20
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