Contact hole shrink by directed self-assembly: Process integration and stability monitored on 300 mm pilot line-Reference-Cited by-同舟云学术

Contact hole shrink by directed self-assembly: Process integration and stability monitored on 300 mm pilot line

Published:2014-05-30 Issue:6S Volume:53 Page:06JC05
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Servin Isabelle,Tiron Raluca,Gharbi Ahmed,Argoud Maxime,Jullian Karine,Chamiot-Maitral Gaëlle,Barros Patricia Pimenta,Chevalier Xavier,Belledent Jérôme,Bossy Xavier,Moulis Sylvain,Navarro Christophe,Cunge Gilles,Barnola Sébastien,Asai Masaya,Pieczulewski Charles

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/53/i=6S/a=06JC05/pdf

Reference32 articles.

1. Block Copolymers—Designer Soft Materials

2. Block Copolymer Nanolithography: Translation of Molecular Level Control to Nanoscale Patterns

3. Epitaxial self-assembly of block copolymers on lithographically defined nanopatterned substrates

4. Monte Carlo Simulation of Coarse Grain Polymeric Systems

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