Development and evaluation of magnesium oxide-based ceramics for chamber parts in mass-production plasma etching equipment
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/56/i=6S2/a=06HC01/pdf
Reference31 articles.
1. Reduction of Particle Contamination in Plasma-Etching Equipment by Dehydration of Chamber Wall
2. Real-time monitoring of scattered laser light by a single particle of several tens of nanometers in the etching chamber in relation to its status with the equipment
3. Observation of the trajectories of particles in process equipment by an in situ monitoring system using a laser light scattering method
4. Generation of positively charged particles at an anode and transport to device wafers in a real radio frequency plasma etching chamber for tungsten etch-back process
5. Capture of flaked particles during plasma etching by a negatively biased electrode
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1. Plasma etching resistance and mechanical properties of polymorph Gd2O3-MgO nanocomposite with Zr phase stabilizer incorporation;Applied Surface Science;2024-11
2. Physiochemical etching characteristics and surface analysis of Y2O3-MgO nanocomposite under different CF4/Ar/O2 plasma atmospheres;Applied Surface Science;2023-12
3. Fluorination behavior of Y2O3-MgO nanocomposite films irradiated by CF4/O2 plasma;Ceramics International;2023-11
4. Microstructural characterization, mechanical properties and erosion behavior of Y2O3–MgO nanocomposite films by magnetron sputtering;Ceramics International;2023-05
5. Plasma resistant glass (PRG) for reducing particulate contamination during plasma etching in semiconductor manufacturing: A review;Materials Today Communications;2023-03
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