Quantitative analysis of peel-off degree for printed electronics-Reference-Cited by-同舟云学术

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Quantitative analysis of peel-off degree for printed electronics

Published:2017-12-28 Issue:2 Volume:57 Page:020304
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Park Janghoon,Lee Jongsu,Sung Ki-Hak,Shin Kee-Hyun,Kang Hyunkyoo

Funder

Alexander von Humboldt-Stiftung

National Research Foundation of Korea

Ministry of Trade, Industry and Energy

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/57/i=2/a=020304/pdf

Reference25 articles.

1. Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics

2. A high-mobility electron-transporting polymer for printed transistors

3. Recent advances in isotropic conductive adhesives for electronics packaging applications

4. High-Performance Printed Transistors Realized Using Femtoliter Gravure-Printed Sub-10 μm Metallic Nanoparticle Patterns and Highly Uniform Polymer Dielectric and Semiconductor Layers

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