Generation and distribution of residual stress during nano-grinding of monocrystalline silicon
Author:
Funder
National Natural Science Foundation of China
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/57/i=12/a=121302/pdf
Reference28 articles.
1. MEMS reliability from a failure mechanisms perspective
2. Quantitative Measurement of Stress in Silicon by Photoelasticity and Its Application
3. Measurement of Residual Stress in Bent Silicon Wafers by Means of Photoluminescence
4. On the residual stress and fracture strength of crystalline silicon wafers
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Recent Developments in Mechanical Ultraprecision Machining for Nano/Micro Device Manufacturing;Micromachines;2024-08-14
2. A critical review on the fracture of ultra-thin photovoltaics silicon wafers;Solar Energy Materials and Solar Cells;2024-08
3. Dislocation slip mechanism and prediction method during the ultra-precision grinding process of monocrystalline silicon;Materials Science in Semiconductor Processing;2024-07
4. Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics;Journal of Manufacturing Processes;2024-06
5. Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding;International Journal of Mechanical Sciences;2023-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3