On the residual stress and fracture strength of crystalline silicon wafers
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4776706
Reference18 articles.
1. Thermoelastic analysis of dislocation generation during edge-defined film-fed growth of polygonal shells
2. Modeling contributions in commercialization of silicon ribbon growth from the melt
3. Photoelastic analysis of frozen stressed specimens using spectral-contents analysis
4. Residual stresses in polycrystalline silicon sheet and their relation to electron-hole lifetime
5. B. Sopori, V. Budhraja, P. Rupnowski, S. Johnston, N. Call, H. Moutinho, and M. Al-Jassim, in Proceedings of the 34th IEEE PVSC (1969), 2009.
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