Influence of bonding pressure on thermal resistance in reactively-bonded solder joints
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=6S1/a=06GP17/pdf
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1. Self‐propagating explosive reactions in Al/Ni multilayer thin films
2. Explosive silicidation in nickel/amorphous‐silicon multilayer thin films
3. Combustion Synthesis Reactions in Cold-Rolled Ni/Al and Ti/Al Multilayers
4. Room-temperature soldering with nanostructured foils
5. Joining of stainless-steel specimens with nanostructured Al/Ni foils
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