Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications-Reference-Cited by-同舟云学术

Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications

Published:2022-08-29 Issue:27 Volume:9 Page:2200078
ISSN:2196-7350
Container-title:Advanced Materials Interfaces
language:en
Short-container-title:Adv Materials Inter

Author:

Zhang Xu‐Dong¹,Yang Guang¹,Cao Bing‐Yang¹^ORCID

Affiliation:

1. Key Laboratory for Thermal Science and Power Engineering of Ministry of Education Department of Engineering Mechanics Tsinghua University Beijing 100084 China

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.202200078

Reference161 articles.

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4. Thermal conductance of single-molecule junctions

5. Thermionic transport across gold-graphene-WSe 2 van der Waals heterostructures

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