Effects of trench profile and self-aligned ion implantation on electrical characteristics of 1.2 kV 4H-SiC trench MOSFETs using bottom protection p-well
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/57/i=6S1/a=06HC07/pdf
Reference30 articles.
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5. Radiation-induced defects in SiC-MESFETs after 2-MeV electron irradiation
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Design of 1.2 kV SiC trench MOSFET using tilted ion implantation for suppression of electric field crowding at the bottom of the gate oxide;Japanese Journal of Applied Physics;2023-01-01
2. Effect of P+ Source Pattern in 4H-SiC Trench-Gate MOSFETs on Low Specific On-Resistance;Applied Sciences;2022-12-22
3. Analysis of Electrical Characteristics in 4H-SiC Trench-Gate MOSFETs with Grounded Bottom Protection p-Well Using Analytical Modeling;Applied Sciences;2021-12-18
4. 1200V 4H-SiC trench MOSFET with superior figure of merit and suppressed quasi-saturation effect;Microelectronics Reliability;2021-08
5. Effects of junction profiles in bottom protection p-well on electrical characteristics of 1.2 kV SiC trench-gate MOSFETs;The European Physical Journal Applied Physics;2019-12
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