Development of air-gap etching process by a mask approach for characterization of intralayer and interlayer capacitances
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/57/i=7S2/a=07ME03/pdf
Reference31 articles.
1. $RC$ Performance Evaluation of Interconnect Architecture Options Beyond the 10-nm Logic Node
2. The Influences of Moisture and Fluorine on the Characteristics of Fluorinated Silicate Glass for Copper Metallization
3. Characterization of low-dielectric-constant SiOC thin films deposited by PECVD for interlayer dielectrics of multilevel interconnection
4. Influence of porosity on electrical properties of low-k dielectrics
5. Ultralow dielectric constant pSiCOH films prepared with tetramethylcyclotetrasiloxane as skeleton precursor
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1. Analysis of Airgaps for OFF-State Capacitance Reduction in SOI-CMOS RF Switches;IEEE Transactions on Electron Devices;2023-11
2. Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction;IEEE Transactions on Electron Devices;2021-10
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