Progress and perspectives in dry processes for nanoscale feature fabrication: fine pattern transfer and high-aspect-ratio feature formation-Reference-Cited by-同舟云学术

Progress and perspectives in dry processes for nanoscale feature fabrication: fine pattern transfer and high-aspect-ratio feature formation

Published:2019-05-30 Issue:SE Volume:58 Page:SE0802
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Iwase Taku,Kamaji Yoshito,Kang Song Yun,Koga Kazunori^ORCID,Kuboi Nobuyuki,Nakamura Moritaka,Negishi Nobuyuki,Nozaki Tomohiro^ORCID,Nunomura Shota^ORCID,Ogawa Daisuke^ORCID,Omura Mitsuhiro,Shimizu Tetsuji^ORCID,Shinoda Kazunori,Sonoda Yasushi,Suzuki Haruka^ORCID,Takahashi Kazuo,Tsutsumi Takayoshi,Yoshikawa Kenichi,Ishijima Tatsuo^ORCID,Ishikawa Kenji^ORCID

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

https://iopscience.iop.org/article/10.7567/1347-4065/ab1638/pdf

Reference179 articles.

1. Impact of plasma processing on integrated circuit technology migration: From 1 μm to 100 nm and beyond

2. Developments of Plasma Etching Technology for Fabricating Semiconductor Devices

3. Defect generation in electronic devices under plasma exposure: Plasma-induced damage

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