Electrochemical activation of substrate surfaces in microelectroforming-Reference-Cited by-同舟云学术

Electrochemical activation of substrate surfaces in microelectroforming

Published:2013-12 Issue:12 Volume:8 Page:872-876
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Shao Ligeng¹²,Du Liqun²³,Wang Liding²³

Affiliation:

1. Key Laboratory for New Energy Battery of Liaoning ProvinceDalian Jiaotong UniversityDalian116028People's Republic of China

2. Key Laboratory for Micro/Nano Technology and System of Liaoning ProvinceDalian University of TechnologyDalian116024People's Republic of China

3. Key Laboratory for Precision & Non‐traditional Machining Technology of Ministry of EducationDalian University of TechnologyDalian116024People's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2013.0484

Reference25 articles.

1. A novel design and micro-fabrication for copper (Cu) electroforming bipolar plates

2. Pulse and pulse reverse plating—Conceptual, advantages and applications

3. Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review

4. Influence of TiC nanoparticles on microstructures and properties of electrodeposited Ni–P coatings

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