Pulse and pulse reverse plating—Conceptual, advantages and applications
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference169 articles.
1. Effects of direct and pulse current on electrodeposition of manganese dioxide
2. Pulse plating of Ni–Mo alloys from Ni-rich electrolytes
3. Current pulse with reverse plating of nickel-iron alloys in a sulphate bath
4. Magnetoresistance of Pulse-Plated Co-Cu Films.
5. Resistivity and Magnetism of Co/Cu Films Produced by Computer Controlled Pulse Electrodeposition
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