Co‐design of micro‐fluidic heat sink and thermal through‐silicon‐vias for cooling of three‐dimensional integrated circuit
Author:
Affiliation:
1. Electrical and Computer EngineeringUniversity of MarylandCollege ParkMDUSA
2. Mechanical EngineeringUniversity of MarylandCollege ParkMDUSA
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering,Control and Systems Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-cds.2013.0026
Reference23 articles.
1. Cong J. Zhang Y.: ‘Thermal via planning for 3‐D ICs’.IEEE/ACM Int. Conf. Computer Aided Design 2005 pp.744–751
2. Placement of thermal vias in 3-D ICs using various thermal objectives
3. Heat sink optimization with application to microchannels
4. High-performance heat sinking for VLSI
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