Numerical simulation of the interfacial stress between epoxy resin and metal conductor of power equipment during epoxy curing
Author:
Affiliation:
1. School of Electrical Engineering Xi'an University of Technology Xi'an China
2. State Key Laboratory of Electrical Insulation and Power Equipment Xi'an Jiaotong University Xi'an China
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/hve2.12206
Reference33 articles.
1. Mechanical stress distribution and risk assessment of 110 kV GIS insulator considering Al 2 O 3 settlement
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