Mechanism of stress generation at the epoxy-epoxy interface

Author:

Wang ChuangORCID,Zhu Weiyu,Zhou Gang,Wang Yang,Chen Chi,Li Xu,Zhang Zaiqin

Funder

National Natural Science Foundation of China

Natural Science Basic Research Program of Shaanxi Province

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry

Reference35 articles.

1. Dielectric characteristics of solid insulation materials with respect to surface roughness;Kim;IEEE Trans. Appl. Supercond.,2014

2. Experimental performance evaluation of solid concrete and dry insulation materials for passive buildings in hot and humid climatic conditions;Rehman;Appl. Energy,2017

3. Study on the dielectric characteristics of gaseous, liquid, and solid insulation materials for a high voltage superconducting apparatus;Hong;IEEE Trans. Appl. Supercond.,2012

4. Synergetic enhancement of mechanical and electrical strength in epoxy/silica nanocomposites via chemically-bonded interface;Li;Compos. Sci. Technol.,2018

5. S.J. Lin Y. Huang D.R. Xie Z. Li D.M. Min S.H. Yu S.T. Li Dielectric relaxation and carrier transport in epoxy resin 2016 IEEE Int. Conf. Dielectr. (ICD) 2 2016 1167 1170 doi: 10.1109/ICD.2016.7547825.

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